Power Electronics Products

"Proterial" material technology contributes to High Integration and High Thermal Management of Power Module

Products & Services for lnverters/Power Modules

Isolation Transformer Amorphous Powder Core / Coil Nano crystalline Alloy FINEMET® Core Isolation Transformer (Soft Ferrite) Choke coil for power factor correction (Amorphous powder core HLM50) Common mode choke coil (Nanocrystalline Alloy FINEMET®) Dual Gauge Copper Strip / Clad Metals Cu / Clad Metals Cu Strip Silicon nitride (Si3N4) Cu Strip / Clad Metals

Inverters

Isolation Transformer for Gate Driver Circuit
HFTR series

Isolation Transformer for Gate Driver Circuit HFTR series

Amorphous Powder Core HLM50 Series

Amorphous Powder Core HLM50 Series

COMMON MODE CHOKE

COMMON MODE CHOKE

On Board Charger

Soft Ferrites

Soft Ferrites

Amorphous Powder Core HLM50 Series

Amorphous Powder Core HLM50 Series

COMMON MODE CHOKE

COMMON MODE CHOKE

Power Module

Materials Our Products
Interconnection/Lead Frame
Spacer
Die SiC Wafer Polishing
Electrode
Insulating Substrate
Heat Spreader-Base Plate

Features & Benefit

Applications Products Features Benefits
Power Module Interconnection
Lead Frame
Spacer
・Various Shapes and Dimensions ・Heatsink integrated Lead
・Control of the Thermal Conductivity and the Thermal Expansion Coefficient ・Low Thermal Stress
・High Electric Corrosion Resistance
Electrode ・Suppression of Crystal Grain Growth at High Temperature ・High Heat Resistance
Insulating Substrate ・High thermal conductivity(90 W/m/K, 130 W/m/K) and High strength(700 MPa) ・High Heat Dissipation
・Thick Copper Electrode
Boost Inductor
Transformer
・Low Core Loss Material Lineup in Wide Frequency Range (10k-2MHz) ・Down-sizing
・High Efficiency
Noise-Reduction Parts (EMI components) ・High Impedance at AM frequency band
・Good Thermal Property
・Down-sizing


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