Insulating Substrate Si₃N₄ for Power Semiconductor Modules

By assigning high thermal conductivity to high-strength, high-pliancy silicon nitride (Si₃N₄) ceramics, we have improved thermal shock resistance and heat-resistant fatigue as well as greatly increased the reliability of semiconductor modules. Furthermore, we have been able to realize a new module structure that was not possible with conventional aluminum and aluminum nitride.

We propose a method to use materials tailored to your company.

Contact Information (Free)

About Personal Information Protection

Proprietary Features

We have succeeded in developing materials of both improved strength and heat conductivity, attributes which usually involve a trade-off. At 130W/m･k, we have achieved the world's highest standard.

Direct Benefits

Figure 1: Conventional Structure

1Conventionally, aluminum and aluminum nitride have been used in the insulation boards of power semiconductor modules, but the mechanical strength is low and there are limitations with the structural design of the module itself. Figure 1 shows the complicated construction.

Figure 2: New Module Structure (Simplified)

2By using the newly developed high-strength, highly heat conductive Si₃N₄ in the insulation board, we have been able to simplify the module structure, as shown in Figure 2. It has become possible to affix a thick Cu Wiring board, thereby lowering thermal resistance. The construction has been further simplified by eliminating the heat dissipation board, resulting in cost reductions.

Associated Benefits

Fields of Applications:

1Can be widely used as a structural material where thermal shock resistance and heat-resistant fatigue are required.
2Its high degree of purity makes it suitable for use as a semiconductor manufacturing device material.

Applications

Insulation boards for Peltier elemental modules
Semiconductor manufacturing equipment material
Heat-resistant structural material

Inquiries

[USA]
Proterial America, Ltd.
2 Manhattanville Road,Suite 301,
Purchase, NY 10577, U.S.A
TEL : +1-914-694-9200
FAX : +1-914-694-9279

[Europe]
Proterial Europe GmbH
Head Office
Immermannstrasse 14-16,
40210 Duesseldorf, Germany
TEL : +49-211-16009-67
FAX : +49-211-16009-30

Milano Branch Office
Via Modigliani 45, 20090 Segrate, Milano, Italy
TEL : +39-02-7530188
FAX : +39-02-7532558

London Branch Office
Sefton Park, Bells Hill, Stoke Poges, Bucks. SL2 4HD. U.K.
TEL : +44-1628-585000

[Asia]
Proterial Asia Pacific Pte. Ltd.
12 Gul Avenue, Singapore 629656
TEL : +65-6861-7711
FAX : +65-6861-9554

Proterial Hong Kong Limited
8/F., Building 20E, Phase 3,
Hong Kong Science Park, Pak Shek Kok,
N.T., Hong Kong
TEL : +852-2724-4183
FAX : +852-2311-2095

Proterial (China), Ltd.
11F, Chong Hing Finance Center,
No. 288, Nanjing Road (West),Shanghai, 200003, China
TEL : +86-21-3366-3000
FAX : +86-21-3366-3012