Power Electronics Products
"Proterial" material technology contributes to High Integration and High Thermal Management of Power Module
Products & Services for lnverters/Power Modules
Inverters
Isolation Transformer for Gate Driver Circuit
HFTR series
COMMON MODE CHOKE
On Board Charger
Soft Ferrites
COMMON MODE CHOKE
Power Module
| Materials | Our Products |
|---|---|
| Interconnection/Lead Frame | |
| Spacer | |
| Die | |
| Electrode | |
| Insulating Substrate | |
| Heat Spreader-Base Plate |
Features & Benefit
| Applications | Products | Features | Benefits | |
|---|---|---|---|---|
| Power Module | Interconnection Lead Frame Spacer |
・Various Shapes and Dimensions | ・Heatsink integrated Lead | |
| ・Control of the Thermal Conductivity and the Thermal Expansion Coefficient | ・Low Thermal Stress ・High Electric Corrosion Resistance |
|||
| Electrode | ・Suppression of Crystal Grain Growth at High Temperature | ・High Heat Resistance | ||
| Insulating Substrate | ・High thermal conductivity(90 W/m/K, 130 W/m/K) and High strength(700 MPa) | ・High Heat Dissipation ・Thick Copper Electrode |
||
| Boost Inductor Transformer |
・Low Core Loss Material Lineup in Wide Frequency Range (10k-2MHz) | ・Down-sizing ・High Efficiency |
||
| Noise-Reduction Parts (EMI components) | ・High Impedance at AM frequency band ・Good Thermal Property |
・Down-sizing | ||
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