Power Electronics Products
"Proterial" material technology contributes to High Integration and High Thermal Management of Power Module
Products & Services for lnverters/Power Modules
Inverters
Isolation Transformer for Gate Driver Circuit
HFTR series
Amorphous Powder Core HLM50 Series
COMMON MODE CHOKE
On Board Charger
Soft Ferrites
Amorphous Powder Core HLM50 Series
COMMON MODE CHOKE
Power Module
| Materials | Our Products |
|---|---|
| Interconnection/Lead Frame | |
| Spacer | |
| Die | SiC Wafer Polishing |
| Electrode | |
| Insulating Substrate | |
| Heat Spreader-Base Plate |
Features & Benefit
| Applications | Products | Features | Benefits | |
|---|---|---|---|---|
| Power Module | Interconnection Lead Frame Spacer |
・Various Shapes and Dimensions | ・Heatsink integrated Lead | |
| ・Control of the Thermal Conductivity and the Thermal Expansion Coefficient | ・Low Thermal Stress ・High Electric Corrosion Resistance |
|||
| Electrode | ・Suppression of Crystal Grain Growth at High Temperature | ・High Heat Resistance | ||
| Insulating Substrate | ・High thermal conductivity(90 W/m/K, 130 W/m/K) and High strength(700 MPa) | ・High Heat Dissipation ・Thick Copper Electrode |
||
| Boost Inductor Transformer |
・Low Core Loss Material Lineup in Wide Frequency Range (10k-2MHz) | ・Down-sizing ・High Efficiency |
||
| Noise-Reduction Parts (EMI components) | ・High Impedance at AM frequency band ・Good Thermal Property |
・Down-sizing | ||
Inquiries
Products & Solutions
ABOUT US
Leading sustainability by high performance
Revenues
1,118.9
billion
Overseas sales ratio
62％
Employees
26,496